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The present paper focuses on the heat transfer problem that describes the heat conduction effects in an OPGW submitted to short-circuit. An analytical solution is proposed which accounts for the effect of the temperature gradients in the... more
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Power dissipation is expected to increase exponentially to 150-250 W per chip over the next decade. To manage this large heat output, it is necessary to minimize the thermal resistance between the chip and a heat dissipation unit that the... more
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The knowledge of the internal temperature transient behaviour of an electronic device allows the spatially resolved thermal characterization of the device itself and the packaging structure. This paper deals with practical and... more
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Background, aim, and scope The interest in polyethylene terephthalate (PET) recycling is quite recent, but it has been growing steadily over the past few years. In this context, the aim of this paper is to assess the eco-profile, the... more
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Our work, during this research and development project, consists of valuing the eco-design, thermal and energy performance qualities of the MPC (Confined Stone Wall) technology at the building level according to the climatic zones in... more
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